Specifications: 4U Rackmount
Processor: 2 x Intel Xeon LGA3647 series
Chipset: Intel C622 chipset
Memory: 24 DDR4 DIMM slots
Hard Drives: 24 hot-swappable drive bays
GPU: Supports up to 8 cards
Power Supply: 2000W 2+2 Redundant
This architecture features a CPU+GPU heterogeneous computing framework, coordinating high-speed IO exchange technology between processing units. It is characterized by high performance, reliability, and ease of maintenance. It is primarily deployed in scientific computing applications such as climate and weather modeling, AI, machine learning, virtual desktops, scientific research, 3D rendering farms, HPC, CFD, CAE, computational physics, biochemical simulation, data analysis, satellite imaging, and computational finance.
Product Parameters
Specification: 4U Rackmount
Processor: 2 x Intel Xeon LGA3647 Platinum/Gold/Silver/Bronze Scalable Processors, TDP ≤ 205W
Chipset: Intel C622 Chipset
Memory: 24 x DDR4 DIMM slots, supports RECC/ECC DDR4, up to 6TB capacity
Hard Drive: Supports 24 x 2.5″ SATA/SAS hot-swappable hard drive bays
RAID: Onboard support for SATA3 RAID 0, 1, 5, 10 (actual configuration may vary)
Expansion Slots: 8 x PCI-E 3.0 x16, 2 x PCI-E 3.0 x8, 1 x PCI-E 3.0 x4, 1 x M.2 Factor: 2260, 2280
Network: 2 x 10 Gigabit Ethernet (RJ45), 1 x IPMI Remote Management (RJ45)
Graphics: Onboard Integrated Graphics, Supports 8 GPU Cards
Audio: None
Power Supply: 2000W 2+2 Redundant
Dimensions: 737mm x 437mm x 178mm (Depth x Width x Height)
Optional: Rear GPU Fan
